Softworld, Inc.
https://cdn.haleymarketing.com/templates/62150/logos/softworldinc-hml.png
http://www.softworldinc.com
http://www.softworldinc.com
true
THIRD PARTY AGENCIES, SUBCONTRACTORS, AND RECRUITERS NEED NOT APPLY. Applicants received from firms will not be considered. Subcontracting is not available for this position.
Active Secret Clearance or above required
Details
• Experience in all of the following areas of electronic design: miniature low power embedded systems, microcontroller and FPGA board design, sensor integration, wireless communication interfaces, power regulation, battery conditioning and maintenance
• Basic experience with microcontroller software (using C/C++/or assembly), and FPGA firmware (VHDL or Verilog). Ability to develop code for bring-up tests or simple demos.
• Familiarity with signal and power integrity analysis tools (Hyperlinx, Ansys)
• Experience with miniature electronic packaging and design using bare die or chip-scale packages. Ability to understand and influence packaging design constraints and requirements for custom designs.
CLEARANCE
• Due to the nature of work performed, U.S. citizenship is required.
Mixed-Signal Design Engineer
Posted: 05/10/2023
2023-05-10
2023-07-01
Employment Type:
Contract
Industry: Engineering
Job Number: 239816-1
Job Description
THIRD PARTY AGENCIES, SUBCONTRACTORS, AND RECRUITERS NEED NOT APPLY. Applicants received from firms will not be considered. Subcontracting is not available for this position.
Active Secret Clearance or above required
Details
• Experience in all of the following areas of electronic design: miniature low power embedded systems, microcontroller and FPGA board design, sensor integration, wireless communication interfaces, power regulation, battery conditioning and maintenance
• Basic experience with microcontroller software (using C/C++/or assembly), and FPGA firmware (VHDL or Verilog). Ability to develop code for bring-up tests or simple demos.
• Familiarity with signal and power integrity analysis tools (Hyperlinx, Ansys)
• Experience with miniature electronic packaging and design using bare die or chip-scale packages. Ability to understand and influence packaging design constraints and requirements for custom designs.
CLEARANCE
• Due to the nature of work performed, U.S. citizenship is required.
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