Softworld, Inc.
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Sr. High Density Die Level Electronics Packaging Engineer
Responsibilities:
Seeking subject matter expertise and proven execution capability in high-density die-level electronics packaging. The position requires skills in design, fabrication, and assembly of integrated multi-die electronic systems for research, commercial, and national defense applications. Experience in a research laboratory or industrial environment and excellent communication and analytical skills are required.
A successful applicant will have expertise in electronics packaging technology and the ability to reduce 2.5- and 3-D integration technologies to practice in a low-rate production environment. Expertise can include design and process development for electronics and MEMS packaging, wafer-scale electronics integration, thin film systems processing, metallurgy, and microscale metrology. System design and experience on multidisciplinary team including vendors and external technologies is critical.
The candidate should have a background in electrical, mechanical, chemical, and/or materials engineering have demonstrated examples of self-driven efforts in technical areas outside her/ his academic training. The candidate will work in a diverse team-based environment alongside technical staff of varying levels of expertise and should be able to execute technical tasks and communicate technical matters to engineering and management. The ability to work independently and be flexible to the continuously evolving nature of research and development efforts is essential. This position includes significant on-site and in-lab contributions.
The position may also require proposal writing, business development, and work with external collaborators from government, academia, and industry.
Qualifications:
Minimum M.S. or equivalent degree(s) in Materials Science, Mechanical Engineering, or other relevant discipline plus 5-10 years of experience in industry or Ph.D. with relevant experience.
Security Clearance:
This position will require the ability to obtain a US Security Clearance. The primary requirement for a security clearance is US citizenship.
High Density Die Level Electronics Packaging Engineer
Posted: 05/05/2023
2023-05-05
2023-07-04
Employment Type:
Contract
Industry: Engineering
Job Number: 240504-1
Job Description
Sr. High Density Die Level Electronics Packaging Engineer
Responsibilities:
Seeking subject matter expertise and proven execution capability in high-density die-level electronics packaging. The position requires skills in design, fabrication, and assembly of integrated multi-die electronic systems for research, commercial, and national defense applications. Experience in a research laboratory or industrial environment and excellent communication and analytical skills are required.
A successful applicant will have expertise in electronics packaging technology and the ability to reduce 2.5- and 3-D integration technologies to practice in a low-rate production environment. Expertise can include design and process development for electronics and MEMS packaging, wafer-scale electronics integration, thin film systems processing, metallurgy, and microscale metrology. System design and experience on multidisciplinary team including vendors and external technologies is critical.
The candidate should have a background in electrical, mechanical, chemical, and/or materials engineering have demonstrated examples of self-driven efforts in technical areas outside her/ his academic training. The candidate will work in a diverse team-based environment alongside technical staff of varying levels of expertise and should be able to execute technical tasks and communicate technical matters to engineering and management. The ability to work independently and be flexible to the continuously evolving nature of research and development efforts is essential. This position includes significant on-site and in-lab contributions.
The position may also require proposal writing, business development, and work with external collaborators from government, academia, and industry.
Qualifications:
Minimum M.S. or equivalent degree(s) in Materials Science, Mechanical Engineering, or other relevant discipline plus 5-10 years of experience in industry or Ph.D. with relevant experience.
- Excellent oral and written communication skills and proficiency with standard workplace and technical software such as Matlab, Python, and/or Labview.
- Competency with CAD and physical modeling tools such as Soildworks.
Security Clearance:
This position will require the ability to obtain a US Security Clearance. The primary requirement for a security clearance is US citizenship.
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