Softworld, Inc.
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http://www.softworldinc.com
http://www.softworldinc.com
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THIRD PARTY AGENCIES, SUBCONTRACTORS, AND RECRUITERS NEED NOT APPLY. Applicants received from firms will not be considered. Subcontracting is not available for this position.
Title: Senior Hardware Engineer
Location: Phoenix, AZ 85034
Type: Contract to hire
Clearance: This position requires you to have or obtain a government security clearance. Security clearances may only be granted to U.S. Citizens.
Overview:
Seeking an experienced Hardware Engineer to join our growing, engaging, and collaborative team. As a valued team member, you will collaborate to deliver leading edge microelectronics that are game changing and impactful to our nation's defense.
You are responsible for:
To succeed in this role, you should have the following skills and experience:
Senior Hardware Engineer
Posted: 10/31/2023
2023-10-31
2023-12-28
Employment Type:
Contract to Hire
Industry: Engineering
Job Number: BBBH72951_1698759130
Pay Rate: Up to US$0.00 per year
Job Description
THIRD PARTY AGENCIES, SUBCONTRACTORS, AND RECRUITERS NEED NOT APPLY. Applicants received from firms will not be considered. Subcontracting is not available for this position.
Title: Senior Hardware Engineer
Location: Phoenix, AZ 85034
Type: Contract to hire
Clearance: This position requires you to have or obtain a government security clearance. Security clearances may only be granted to U.S. Citizens.
Overview:
Seeking an experienced Hardware Engineer to join our growing, engaging, and collaborative team. As a valued team member, you will collaborate to deliver leading edge microelectronics that are game changing and impactful to our nation's defense.
You are responsible for:
- Electrical design with a strategic focus on Signal Integrity and Power Integrity (SIPI) analysis across Microsystems BU Memory, Space, and System-in-Package (SiP) product lines.
- This position offers an opportunity to collaborate closely with electrical, CAD, and other SIPI engineers to perform SIPI simulations for PCB and package designs to ensure products meet or exceed the specifications for high-speed interfaces and power requirements.
- As part of this team, you will have responsibilities spanning all phases of the product development life cycle, including requirements analysis, design, verification, integration, and documentation.
- Support Hardware design, analysis, and simulations for all Microsytems products and engineering responsibilities
- Design, model, simulate, and analysis of high frequency packages and boards for System in Packages (SiP), Space SSDR's with flex circuits, high-speed products, power modules and custom products
- Understand customer applications and industry standards to support defining the product specifications to meet all signal and power integrity requirements.
- Support all interface types including high-frequency RF, DDR4/DDR5,? 50Gb/s.
- Work cross-functionally with electrical, package design, mechanical, test and manufacturing engineers to plan and architect the power delivery and Signal integrity needs of packages and PCBs for Microsystems next generation products
- Work with leading suppliers to define and innovate new ideas to enable the Aerospace, Defense, and Space technology industry while pushing the boundaries to achieve unprecedented performance on our products using the latest EDA tools and methodologies
- Participate in all aspects of engineering review process which includes schematic review, functional specification, PCB/substrate/Interposer placement review and PCB/substrate/Interposer routing reviews
- Stack up creation and guidance to hardware engineers for all PCB/Substrate/Interposer designs
- Support power integrity including AC and DC analysis and provide feedback to layout / hardware engineering
- Conduct cross talk analysis and provide feedback to layout and hardware engineering
- Documenting signal integrity rules for hardware engineers and CAD layout
To succeed in this role, you should have the following skills and experience:
- Must be able to obtain and maintain a government security clearance
- Experience designing and simulating signal and power integrity solutions for high-speed system components (packages, PCB, Interposers, substrates)
- Strong understanding of Electromagnetic fundamentals and transmission line theory, along with signal and power distribution systems
- Understanding of jitter and crosstalk and how it impacts the design in the system environment
- Able to navigate in layout tools used for PCB and Packages Cadence Allegro preferred.
- High speed channel simulations for low BER and transient simulation for SI and PI, along with measuring and correlating to lab analysis
- Detailed understanding of s-parameters, Smith Chart and frequency domain analysis
- Simulation of passive and active components with the following tool sets: Ansys HFSS and HFSS 3D Layout, SIwave Electronics Desktop, HSPICE, Q3D, Keysight ADS, and SiSoft QSI / QCD
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